This position is associated with the sale of Intel’s NAND memory and storage business to SK Hynix (You can read more about the transaction in the press release – https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel – come join our team and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As the global leader in the semiconductor industry, Intel possesses many industry-leading SSD technologies including the most capable Quadruple Level Cell (QLC) NAND Flash products. As a Hardware Engineer, you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.
This position aligns to Phase 1 of the transaction, which includes the 3DNAND enterprise and client SSD business. Phase 1 is expected to close in late 2021, subject to regulatory approvals and other customary conditions. At deal close, all employees aligned to this phase of the transaction will transition to SK Hynix.
NSG is a business group within Intel that is responsible for the design, development, and manufacturing of SSDs for both client and enterprise applications.
As a mechanical engineer within Intel’s Non-Volatile Memory Solutions Group, you will be part of a hardware design team that defines, designs, validates and manufactures Solid-State Drives (SSD) for data center applications. You will collaborate with the PCB design team to optimize component placement and SSD drive enclosures for mass production. You will be creatively applying your technical know-how engineering fundamentals, scientific knowledge, systems thinking, analytical thinking, prototyping, and testing knowledge against design constraints and boundary conditions to develop and productize cost optimized, mass producible SSD drives. You will also design and build proof-of-concept prototypes, perform Design-of-Experiments DOE, mechanically instrument prototypes for thermal and mechanical stress analysis, and help perform technical analysis and feasibility studies. To accomplish your deliverables you will use leading CAD software packages like SolidWorks for model creation and will analyze your design for thermals using CFD tools like FloTherm and FEA tools like ANSYS. You will work on developing key relationships with internal design teams, with Intel’s outsourcing organization as well as suppliers to plan comprehensive product strategies based on future technologies.
The ideal candidate should exhibit the following behavioral traits:
Manage multiple projects and meet deliverables and timelines
Work with minimal supervision
Demonstrated verbal (public speaking) and written (in the form of reports and presentations) communications skills
Qualifications
You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/ or work experience. This is an entry level position and will be compensated accordingly.
Education
BS or MS degree in either Mechanical, Civil, Aerospace Engineering or other related fields.
Minimum Qualifications:
Minimum of 6+ month of experience in:
Applying heat transfer mechanics of materials statics and dynamics to mechanical designs
Academic or project or work experience in drafting manufacturing drawings per ANSI standards and GD&T standards
Experience in performing assembly tolerance analysis using EXCEL, JMP, Crystal Ball or equivalent tools
Experience using SolidWorks for 3D mechanical design and 2D drafting
Preferred Qualifications
Minimum of 6+ month of experience in generating experimental plans for lab instrumentation and measurements
Experience is applying CFD analysis using FloTherm Icepak or similar software to design complex assemblies
Experience in performing structural simulations using FEA tools like ANSYS or ABAQUS to analyze how designs react to real world conditions
Experience in performing or directing shock and vibration testing of electronic packages
Experience creating project plans and test plans
Knowledge of mechanics of materials
Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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